ABF Substrate (FC-BGA) Market Growth Analysis 2025

The global market for ABF (FCBGA) Substrate was valued at US$ 5.16 billion in the year 2023, is projected to reach a revised size of US$ 10.2 billion by 2030, growing at a CAGR of 9.86% during the forecast period 2024-2030.

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PCBs are key component of various electronic products. They are used in computers, communications, and various consumer electronic products and equipment. In recent years, they have been widely used in the automotive, industrial, medical, military and aerospace industries. Therefore, the development of this industry is driven by the advancement of modern science and technology, and is closely related to the demand of various end products.

Currently the ABF (FCBGA) Substrates are mainly produced in Japan, China Taiwan, South Korea, Southeast Asia and China Mainland, etc.

The Japan market for ABF (FCBGA) substrates was valued at US$ 1,684 million in 2023 and will reach US$ 2,746 million by 2030, at a CAGR of 7.21% during the forecast period of 2024 through 2030.

The China Taiwan market for ABF (FCBGA) substrates was valued at US$ 2,011 million in 2023 and will reach US$ 3,079 million by 2030, at a CAGR of 6.03% during the forecast period of 2024 through 2030.

The South Korea market for ABF (FCBGA) substrates was valued at US$ 614 million in 2023 and will reach US$ 1,677 million by 2030, at a CAGR of 12.97% during the forecast period of 2024 through 2030.

The China Mainland market for ABF (FCBGA) substrates was valued at US$ 654 million in 2023 and will reach US$ 2,284 million by 2030, at a CAGR of 18.92% during the forecast period of 2024 through 2030.

The global key manufacturers of ABF (FCBGA) substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2023, the global top five players had a share approximately 73% in terms of revenue.

Asia Pacific is the largest market, holds a share about 78%, key consumers in Asia are Chinese Taiwan, South Korea, Japan, China mainland, and Southeast Asia.

In terms of products, 4-8 Layers ABF substrates are the most common used products, due to the strong demand from PC. In next few years, the segment over 10 layers ABF substrate will be widely used, driven by the demand of AI, HPC chips, high end servers and 5G.

Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2023, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates, such as Anhui Splendid Technology, Aoxin Semiconductor Technology (Taicang), and Keruisi Semiconductor Technology (Dongyang) etc. The global competitive situation will be totally different after two or five years, filled with uncertainty.

Report Scope

This report aims to provide a comprehensive presentation of the global market for FC-BGA, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding FC-BGA.

The FC-BGA market size, estimations, and forecasts are provided in terms of output/shipments (K Square Meters) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global FC-BGA market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the FC-BGA manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

§ Unimicron

§ Ibiden

§ Nan Ya PCB

§ Shinko Electric Industries

§ Kinsus Interconnect

§ AT&S

§ Semco

§ Kyocera

§ Toppan

§ Zhen Ding Technology